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    礦ision Build Log
    Project:
    F:\佳显电子\新产品开发\新产品开发--合力泰电子纸\常规品\换图\GDEH075Z10_SSD1677-20200220\Project\mdk.uvproj
    Project File Date:  09/06/2018

    Output:
    Build target 'mdk'
    compiling main.c...
    linking...
    Program Size: Code=4766 RO-data=116498 RW-data=32 ZI-data=1632
    FromELF: creating hex file...
    ".\Debug\obj\mdk.axf" - 0 Error(s), 0 Warning(s).
    Load "F:\\佳显电子\\新产品开发\\新产品开发--合力泰电子纸\\常规品\\换图\\GDEH075Z10_SSD1677-20200220\\Project\\Debug\\obj\\mdk.axf"
    Set JLink Project File to "F:\佳显电子\新产品开发\新产品开发--合力泰电子纸\常规品\换图\GDEH075Z10_SSD1677-20200220\Project\JLinkSettings.ini"
    * JLink Info: Device "STM32F103VB" selected (128 KB flash, 20 KB RAM).

    JLink info:
    ------------
    DLL: V4.76d, compiled Sep 13 2013 16:35:06
    Firmware: J-Link ARM-OB STM32 compiled Aug 22 2012 19:52:04
    Hardware: V7.00
    S/N : 20090928
    Feature(s) : RDI,FlashDL,FlashBP,JFlash,GDBFull

    * JLink Info: Found SWD-DP with ID 0x1BA01477
    * JLink Info: Found SWD-DP with ID 0x1BA01477
    * JLink Info: Found Cortex-M3 r1p1, Little endian.
    * JLink Info: FPUnit: 6 code (BP) slots and 2 literal slots
    * JLink Info: TPIU fitted.
    * JLink Info: ETM fitted.
    ROMTableAddr = 0xE00FF003

    Target info:
    ------------
    Device: STM32F103VB
    VTarget = 3.300V
    State of Pins:
    TCK: 0, TDI: 0, TDO: 1, TMS: 0, TRES: 1, TRST: 1
    Hardware-Breakpoints: 6
    Software-Breakpoints: 8192
    Watchpoints:          4
    JTAG speed: 4000 kHz

    Erase Done.
    Programming Done.
    Verify OK.
    Application running ...